Start of Demonstration Test of Two-Phase Direct-to-Chip Cooling in the Air-Cooled Data Center

Start of Demonstration Test of Two-Phase Direct-to-Chip Cooling in the Air-Cooled Data Center

Tokyo, November 20, 2024 – Mitsubishi Heavy Industries, Ltd. (MHI), NTT Communications Corporation (NTT Com), and NEC Networks & System Integration Corporation (NESIC), will begin demonstration testing in December to increase the cooling capacity of data centers without major modifications to existing facilities by introducing high-performance servers equipped with two-phase direct-to-chip cooling systems to data centers currently in operation. The demonstration test is being conducted in response to the adoption of a proposal to introduce systems using MHI’s two-phase direct-to-chip cooling to the data center, for a project from the Tokyo Metropolitan Government’s Bureau of Industrial and Labor Affairs to support the early practical application of technologies to advance the establishment of GX-related industries. This demonstration aims to achieve energy savings in server power consumption and reducing CO2 emissions by utilizing existing data center facilities.

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